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FTR: 2.2uH 3A inductor

FUNCTIONAL TEST REPORT

DC-DC CONVERTER MODULE

Description: DC-DC CONVERTER MODULE TPS562201DDCR  with 2.2uH 3A Inductor (SP26040439)

Product Code

HW Version 01
Tested By

Date

1. Required Equipment

  • DC Power Supply: Variable voltage with current limiting.

  • Electronic Load: Supporting CC (Constant Current) and CV (Constant Voltage) modes.

  • Oscilloscope: Minimum 100MHz bandwidth.

  • Digital Multimeter (DMM): High precision (4.5 digit preferred).

  • Thermal Measurement: IR Thermometer or Thermal Camera.

2. Test Set Up:

Input (VDC)
4V-12-24V  ( increase step by step) (according IC specs)
Output voltage(V)
4V, 5V, 12V  Test applied based on required voltage
Output current (A) 0A -> 1.5A  (according IC specs)

*Nominal value: 24V

3. Test Procedures

Step 1: Visual Inspection & Continuity Check

Ref Test Item Acceptance Criteria Result (P/F) Notes
1.1 Visual Assembly No missing components, no cold solder joints.    
1.2 Input Impedance Resistance between Input + and GND > 100kOhm    
1.3 Output Impedance Resistance between Vour+ and GND > 10kOhm    

Step 2: Basic Functional Test (No Load & Light Load)

Ref Test Condition Parameters Measured Value Evaluation(P/F) Note
2.1 Nominal Vin, No Load Output Voltage(V)    
2.2 Nominal Vin, No Load Quiescent Input Current (mA)    
2.3 Vin Min to Max range Line Regulation (%)
  How to test

Step 3: Load Regulation & Efficiency Test

Set Vin to nominal value.

Load (%) Output Current (Iout​) Output Voltage (Vout​) Ripple (Vpk−pk​) Efficiency (%)
10%        
50%        
100%        

Step 4: Dynamic Performance (Oscilloscope)Oscilloscope picture capture)

4.1 Ripple & Noise 

Description: Check for high-frequency switching noise over range of input voltage

% Load

10% Load

50% Load

75%

100%

Note

Vin: 5V

20mV25mV40mV

30mV...

How to measure

Vin 12V






Vin 24V






Ref Test Item Waveform Description Measured (Pk-Pk) ResultNote
4.1 Ripple & Noise Check for high-frequency switching noise.   Pick the highest value
4.2 Soft-start / Startup Smooth ramp-up, no significant overshoot.    
4.3 Transient Response Load step 25% $\to$to 75% $\to$to  25%.    

Step 5: Protection Mechanisms

Ref Protection Type Test Method Module Behavior Evaluation (Passs/Fail)
5.1 Over-Current (OCP) Increase load to >120% of rated. Shutdown or Foldback  
5.2 Short-Circuit (SCP) Short the output terminals. Hiccup or Shutdown  
5.3 Over-Temp (OTP) High load + restricted airflow. Thermal shutdown  

3. Thermal Analysis (After 30 min at Full Load)

  • ComponentDesignatorTemperatureNote
    IC ControllerIC1

    InductorL1

    CapacitorC1

    CapacitorC2..

    PCB










    PowerThermal ICImage: Temperature: ........... $^\circ$C

  • Inductor Temperature: ........... $^\circ$Cimage.png

  • MOSFET/Diode Temp: ............ $^\circ$C

4. Final Conclusion

$\square$ PASSED: Module meets all technical specifications.

$\square$ FAILED: Reasons: .............................................................................................................

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